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Customizable Cavity PPE JEDEC IC Trays Heat‑Resistant For Semiconductor Packaging

Shenzhen Hiner Technology Co., Ltd.
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Customizable Cavity PPE JEDEC IC Trays Heat‑Resistant For Semiconductor Packaging

Model Number : HN25074

Color : Black

Supply Ability : 2000PCS/Day

Tray Shape : Rectangular

Packing Level : Transport package

MOQ : 500 pcs

Delivery Time : 10 workdays

Incoterms : EXW, FOB, CIF, DDU, DDP

Clean Class : General And Ultrasonic Cleaning

Payment Terms : T/T

Reusable : Yes

Flatness : Less than 0.76mm

Price : $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)

Mold Type : Injection

Capacity : 4×14=56 PCS

Certification : ROHS, ISO

Quality Assurance : Delivery Guarantee, Reliable Quality

Place of Origin : China

Cavity Size : 25×16×2.25 mm

Brand Name : Hiner-pack

Tray Weight : Varies, Typically Up To 500 Grams Per Cavity

Packaging Details : CARTON, PALLET

Ic Type : BGA,QFP,QFN,LGA,PGA

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Customizable Cavity PPE JEDEC IC Trays Heat‑Resistant For Semiconductor Packaging

Looking for reliable holders for delicate semiconductor chips? Built from robust PPE material, deliver solid protection during chip test and packaging. Stand up to high heat and block dust harm for sensitive electronic units.


Fit diverse chip specifications. Custom cavity design acts as core service. Adjust cavity layout, dimensions to satisfy varied semiconductor project demands.


Support full semiconductor production workflow. Keep chips stable in high‑temp working environment. Bring steady protection across testing assembling and component shipment.

Key Features/ Benefits
  • Made of durable PPE raw material
  • Heat-proof and anti-contamination
  • Anti‑static performance guard IC components
  • More than 12 years of export experience.
  • With professional engineers and efficient management.
Specifications
Brand Hiner-pack
Model HN25074
Material PPE
Package Type JEDEC
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 322.6×135.9×9.35 mm
Cavity Size 25×16×2.25 mm
Matrix QTY 4×14=56 PCS
Warpage MAX 0.76mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications

Suit semiconductor chip testing and high‑temperature production processes. Hold IC parts steady inside automated assembly lines.


Fit bulk component storage and cross‑border shipment. Protect sensitive semiconductor units. Accept special custom solutions for non‑standard chip models.

Packaging & Shipping/ Services

Stack neatly with protective separators inside thick cartons. Prevent bump and scratch during internal handling.


Support sea air and express delivery. Maintain stable lead time. Reinforced outer packing reduce risk for long‑distance global transport.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / Waffle Pack Trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers

Quality Customizable Cavity PPE JEDEC IC Trays Heat‑Resistant For Semiconductor Packaging for sale

Customizable Cavity PPE JEDEC IC Trays Heat‑Resistant For Semiconductor Packaging Images

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